We proudly announce the launch of newly improved MICROWIND version 3.5 with many new and exciting features.

			Node locked software based licensing to ease your license management and reduce the security cost involved in software development.
			Supports Windows 2000/XP and new Windows 7 (32/64 bit).
			Introduction of 32nm & 45nm technology design rule file with their application notes.
			Added a new screen for process/Voltage/Temperature Min, Typ, max modes.
			Zoom In Navigator added at bottom of the palette that eases the navigation in the case of very large designs.
			A spectacular command '3D View of the IC' which enables to draw real-time images of the layout and navigate in fill-3D on the surface or inside the IC based on OpenGL and offers outstanding picture quality.
			Metallization macros which ease the addition of contacts in the layout have been updated to handle up to 8 layers of metal especially for 45nm technology.
			Totally new companion software tutorial 'silicon' to give a user's controlled 3D view of silicon atoms such as SiO2 and carbon nanotubes.
			Improved Global Delay Evaluation at integrated circuit level.
			Enhanced Global Crosstalk evaluation effect based on analytical approximations of the coupling amplitude.
			Improved and new Help on Design Rules.
			Improve drawing speed (specifically pads) with very large screen resolution.
			Improved 3D views for 65, 45 and 32nm technologies based on Intel/Ibm technologies.
			Improved Microwind/Dsch 3.5 manual including some new features (Ion/Ioff, PVT variations)
			DSCH : Added a tool on fault analysis at the gate level of digital. Faults: Stuck-1, stuck-at-0. The technique allows injection of single stuck-at fault at the nodes of the circuit.
			DSCH : Improved interface between DSCH and Winspice.
			..many more improvements in software function & operation.
			Lite version evaluation available in early September 2010
			Click here to read What's New page of 3.1 version.